Chemsol Heat Sink Paste

Product Description

CHEMSOL HEAT SINK PASTE, also known as thermal compound, thermal paste, or CPU grease, is a thermally conductive yet electrically insulating compound. It is designed to enhance heat transfer between heat sources and heat sinks, making it ideal for high-power semiconductor devices.

With thermal conductivity ranging from 1 to 5, this paste eliminates air gaps that act as thermal insulators, ensuring maximum heat dissipation and protecting electronic components from overheating. It is a reliable thermal interface material, widely used in semiconductor applications.

Key Benefits:

• Excellent chemical stability and weather resistance
• Superior electrical insulation properties
• Non-corrosive formulation
• Outstanding heat and cold resistance
• Operates efficiently in a temperature range of -30C to 250C
• High thermal conductivity with excellent flame retardancy

Applications:

CHEMSOL HEAT SINK PASTE is recommended for the protection and thermal management of sensitive components, including:

• LEDs, Computers, Motherboards (M/B), Power Supply (P/S) Radiators
• Electronic components such as ICs, CPUs, and MOS transistors
• DDR modules and DVD applications
• LCD TVs, Laptops, Wireless receivers, and Telecommunication equipment